Abstract: High-temperature resistance prepreg was prepared with modified epoxy resin adhesive and appropriate glass cloth. The gelation time of the adhesive, as well as weight loss ratio of dust, adhesive flow, peel strength, resistance to soldering, dimensional stability and coefficient of thermal expansion of the prepregs were studied for the preparation and the subsequent service performance. It was found that the comprehensive performance of the prepreg was excellent, the prepreg completely met the manufacturing requirement of rigid-flex board and multilayer printed circuit board.

Key words: prepreg, high-temperature resistance, rigid-flex board